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WND companies showcase innovative solutions at international exhibitions

Updated: Jun 21, 2023 Print
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People visit the German International Foundry Trade Fair in Düsseldorf, Germany. [Photo/]

A number of technology companies from the Wuxi New District (WND) recently brought their cutting-edge products and solutions to overseas exhibitions to explore global markets and new business opportunities.

For example, Wuxi Hisky Medical Technologies Co Ltd, which specializes in non-invasive diagnostics and management, introduced its flagship product, iLivTouch, at the 2023 Digestive Disease Week (DDW), one of the world's largest medical conferences in Chicago, the United States, in May.

Through transient elastography (TE) technology, iLivTouch can measure liver stiffness and ultrasound attenuation parameters in just two minutes, helping medical staff with liver health screening, diagnosis, and treatment evaluation.

As one of the few Chinese participants, Hisky also hosted consultations and exchanges with experts and scholars from different countries during the event.

Meanwhile, at the German International Foundry Trade Fair and Technical Forum (GIFA), which was held from June 12 to 16 in Germany, Unicomp Technology showcased its intelligent X-ray CT inspection equipment.

Unicomp has been a leading supplier of industrial X-ray CT intelligent inspection equipment since its establishment in 2009. It provides comprehensive solutions for customers in various fields, including integrated circuits, electronic manufacturing, and new energy batteries.

Furthermore, from June 21 to 24, Danikor, a reliable provider of solutions in the field of automatic feeding and intelligent tightening, is participating in the Manufacturing Expo 2023, an international machinery manufacturing exhibition in Thailand.

With years of expertise, Danikor has been recognized both domestically and internationally for its high-quality products and professional technical support. Its products have extensive applications in industries such as automotive components, 3C electronics, aerospace and defense, 5G/chip semiconductors, and biomedicine.

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