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Xi'an High-tech Comprehensive Bonded Zone

Updated: May 21, 2019 govt.chinadaily.com.cn Print
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Approved on Sep 22, 2012, Xi'an High-tech Comprehensive Bonded Zone, covering an area of 3.64 square kilometers, is located in the city's southwestern Xi'an Hi-tech Industries Development Zone.

The zone integrates all functions and policies of the special regulatory areas supervised by customs. It serves as a bonded area, an export processing and a bonded logistics park with the most favorable policies, simplified administrative procedures and open environment.

To date, the high-end flash memory chip project, invested by Sumsung Electronics Co Ltd, has based its operation in the zone, together with 15 supporting enterprises. It is the largest foreign high-tech electronic industrial project of the company in the country.

In the future, the zone will build itself into a comprehensive area of bonded logistics, trade, processing with advanced facilities and convenient transport.

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