Chengdu is a renowned software city in China. It is a national integrated circuit design industrialization base; a national high-tech industrial base for the information industry; a national information security achievement industrialization base; a cross-straits wireless industrial cooperation pilot city, and an e-commerce demonstration city.
As the largest pillar industry in Chengdu, the electronic information industry will create the first trillion-yuan industrial cluster, gathering well-known enterprises at home and abroad, such as Foxconn, Microsoft, IBM, Huawei, Intel, Lenovo, China Electronics Corp, China Electronics Technology Group Corporation, Dell, AMD, Tsinghua Unigroup, Texas Instruments, BOE Technology Group and TIANMA. It will launch major projects such as Intel’s largest packaging test center in Asia, Tsinghua Unigroup's memorizer production base and Chip City, BOE's advanced AMOLED panel production line, China Electronics Corp's 8.6-generation LCD panel production line, and Dell's global flagship terminal manufacturing base. The cluster will have strong advantages and a complete industrial system in integrated circuits, electro-optic displays, intelligent terminals, network communications, 'IoT', big data, information security, software and service outsourcing. Thus it will become an important global electronic information industry base and a critical development engine for the domestic electronic information industry.
In 2018, the worth of Chengdu's electronic information industry reached 736.6 billion yuan ($105.62 billion). Of this, the prime operating revenue of the electronic information manufacturing industry was 346.4 billion yuan, and the cumulative operating income of the software service industry was 390.2 billion yuan. By 2022, it is planned that the prime operating revenue of Chengdu’s electronic information industry will reach 1.2 trillion yuan, building Chengdu into a globally competitive electronic information manufacturing base and a world-class software city.