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2 national manufacturing innovation centers land in Shanghai

Updated: Jul 5, 2018 Print


Authorities announce the official launch of a national integrated circuit innovation center and a national intelligent sensor innovation center in Shanghai on July 3. [Photo/]

Authorities announced the official launch of two national manufacturing innovation centers in Shanghai on July 3.

The national integrated circuit (IC) innovation center, located at the Fudan University Zhangjiang Campus in Pudong, will be co-built by Fudan University, and two leading Chinese IC manufacturers: SMIC and Huahong Group.

The center will focus on the R&D of ICs at 5 nanometers or below and technologies including advanced simulation, extreme ultraviolet lithography (EUV), object linking and embedding for process control (OPC), and advanced integrated technique.

It will also bring together more IC giants, research institutes, and high-profile personnel to develop itself into a leading IC R&D platform.

The national intelligent sensor innovation center, situated in Jiading district, will concentrate on sensor technology innovation, with the hope of developing into a world class intelligent sensor innovation center.

It will unite leading forces in the field, such as the Sensors and IoT Industry Association, which boasts 600 member companies, to contribute to its goal.


Luo Wen, Vice Minister of Industry and Information Technology, speaks at the launch ceremony of two national manufacturing innovation centers in Shanghai on July 3. [Photo/]

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